Report: Xbox 360 Jasper chipset contracted for production, Valhalla on deck
...Semiconductor Manufacturing Co. (TSMC) will build the chips, Advanced Semiconductor Engineering will test and package them, and Nanya will supply flip-chip packaging substrates (which sure do sound important). The Jasper combo will ideally use less power, simplify cooling and, most importantly, cut back on the console's jibba jabba
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